Login Form

Contact info

Project Coordinator

  logo iccs  logo NTUA



Dr. Christos Kouloumentas
Tel: +30 210 772 2057
mail: ckou(at)mail.ntua.gr 
Prof. Hercules Avramopoulos
Tel: +30 210 772 2057
mail: hav(at)mail.ntua.gr
Technical Manager
III-V lab
Dr. Agnieszka Konczykowska
Tel: +33 (0)1 6040 6867
mail: agnieszka.konczykowska

Integration Platforms

PANTHER will invest on the combination of the following technologies and integration platforms:

  • Passive optical polymers: FhG-HHI has developed a single-mode polymer platform for multi-functional PLCs. Structures that can be monolithically integrated include among others low-loss waveguides (<0.5 dB/cm), MMI couplers, tunable couplers, 90o optical hybrids, Bragg-gratings, DIs, VOAs and AWGs. Using the platform as an optical integration bench, filters and polarization elements such as PBS and polarization rotators can also be integrated, whereas hybrid integration of lasers, gain chips and photodiodes is also supported.
  • InP Mach Zehnder modulator arrays: The modulator group of FhG-HHI has developed a stable and powerful material system based on the InP technology that has recently enabled the development of high-bandwidth (>42 GHz) IQM arrays for operation at 64 Gbaud with high-order modulation formats. Within PANTHER, arrays of InP MZMs will be hybridly integrated with passive polymer boards for the development of high-capacity/high-flexibility optical transmitters.
  • InP photodiodes: FhG-HHI has also developed the technology for waveguide-integrated InP photodiode arrays that are based on layered structures and evanescent coupling schemes and exhibit record combination of responsivity and bandwidth. Within PANTHER, 4-fold and 8-fold arrays will be hybridly integrated with the polymer-based optical front-end of coherent receivers for detection of signals at rates up to 64 Gbaud.  
  • InP double heterojunction bipolar transistor (InP-DHBT) technology: III-V Lab has developed an InP-DHBT integration platform and realized high speed electronic circuits, such as digital-to-analog converters (DACs), MUX/DEMUX circuits, drivers, transimpedance amplifiers (TIAs) and clock and data recovery circuits) with record performance in terms of maximum frequency and output voltage swing. Within PANTHER, 2:1 MUX circuits, 3-bit DACs and differential TIAs with automatic gain control will be designed for operation at 64 Gbaud and will be integrated with the optical parts in system-in-package transceiver modules.


  • pather modules