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Project Coordinator

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Dr. Christos Kouloumentas
Tel: +30 210 772 2057
mail: ckou(at)mail.ntua.gr 
Prof. Hercules Avramopoulos
Tel: +30 210 772 2057
mail: hav(at)mail.ntua.gr
Technical Manager
III-V lab
Dr. Agnieszka Konczykowska
Tel: +33 (0)1 6040 6867
mail: agnieszka.konczykowska

Deliverable D7.4 (Public Version)

This is he public version of deliverable D7.4 ("Standardization of PANTHER technology and manufacturability plan") Download here

The first part of this report describes the basic fabrication steps for the four main types of components that are involved in the development of PANTHER modules (the InP photodiodes (PDs), the InP Mach-Zehnder modulators (MZM), the polymer chips (PolyBoards) for the processing of light at the transmitter/receiver side, and the InP-double heterojunction bipolar transistor (InP-DHBT) electronic components).Specific modifications / improvements in the fabrication process are described in order to support a true production line for this type of transceivers in the future. Moreover, the document describes the basic methodology and decisions regarding the assembly of these components and the packaging of PANTHER transceivers. Also in this case, specific modifications are outlined in order to improve the automation of this process and support medium or high volume production.
The second part of the document presents the progress on the definition of the standards for the development of high-capacity optical transceivers for metropolitan and wide area networks. PANTHER component and integration technology appears to cover the requirements of these standards regarding the speed, flexibility, power consumption and form-factor of the optical transceivers and reveals the exploitation potential of PANTHER technology.